Ultrasonic Pin Welding System

The Ultrasonic Pin Welding System was developed specifically for pin connections in power semiconductor modules. It is suitable for processing a wide variety of pin geometries, including solid pins, pin sockets, and eyelet pins, and can be used on DBC ceramic substrates and various power module platforms. The ultrasonic welding process completely replaces conventional soldering processes and enables high-strength, reliable connections with low contact resistance and optimized thermal conductivity — without an additional cleaning process. Through the combination of optical process guidance and a fully servo-driven motion system, the system realizes a fully automated process sequence from pin feeding to welding.