Ultrasonic welding systems for power electronics/semiconductors

The manufacturing and packaging of power semiconductors such as IGBT and SiC modules place the highest demands on welding precision, process stability, and process control. Ultrasonic welding enables a material-locking solid-state bond without filler metals and with low thermal stress on the components.
In power electronics, ultrasonic technology is used, among other things, for terminal welding, pin welding, and aluminum and copper wire bonding. The precise control of welding force, amplitude, and process energy enables reproducible connections and is suitable for demanding applications in power electronics and automotive electronics.
Our ultrasonic welding systems offer solutions for IGBT and SiC power modules, DBC substrates, and other semiconductor and power electronics applications.