- Products
- Ultrasonic Wire Bonding System
Ultrasonic Wire Bonding System
The Ultrasonic Wire Bonding System was developed for highly reliable applications in power electronics and is suitable for copper wire, copper ribbon, aluminum wire, and aluminum ribbon bonding. It is used primarily in IGBT and SiC power modules, automotive electronics, battery and energy storage systems, and other demanding power semiconductor applications.
The system supports copper wires and copper ribbons from 8 to 20 mil (200–500 μm), aluminum wires from 4 to 20 mil, and aluminum ribbons from 500 × 100 μm to 2,000 × 300 μm. This covers a wide range of bonding requirements from high-current copper connections to flexible aluminum wire and ribbon applications.
Integrated quality monitoring, non-destructive ALC pull-force tests, automatic online pressure calibration, and full process traceability enable continuous inline process control and ensure stable series production.
Application Range
•IGBT modules
•SiC power modules
•Automotive electronics
•Battery and energy storage systems
•Onboard chargers
•Laser systems
•SiC power modules
•Automotive electronics
•Battery and energy storage systems
•Onboard chargers
•Laser systems
Product Advantages
- Dual-gantry Y-axis for high dynamics and precision
- Vibration-isolated granite platform for maximum process stability
- Magnetic spring compensation to protect consumable components
- ZR decoupling for reduced stress on sensitive assemblies
- Integrated ALC quality control in real time
- Automatic pressure calibration for stable process parameters
- High-resolution GBS vision system for precise tool positioning
- Flexible automation solutions for different production lines
Technical Specifications
Copper Wire / Copper Ribbon
| Parameter | Specification |
| Dimensions | 800 × 1,700 × 1,950 mm |
| Weight | 1,200 kg |
| XY Travel | 300 × 300 mm |
| XY Resolution | 0.1 μm |
| Z Stroke | 50 mm |
| Z Resolution | 0.1 μm |
| Rotation Axis | ±220° |
| R-Axis Resolution | 0.096° |
| Wire Diameter | 8–20 mil |
| Frequency | 80 ±2 kHz |
| Bond Force | 500–5,000 g |
| Bond Speed | 1.2 s per wire |
| Bond Head | Front Cut |
Technical Specifications – Aluminum Wire / Aluminum Ribbon
| Parameter | Specification |
| Aluminum Wire | 4–20 mil |
| Aluminum Ribbon | 500 × 100 μm to 2,000 × 300 μm |
| Frequency | 60/80 kHz dual frequency (optional) |
| XY Drive | Linear motor |
| XY Resolution | 0.1 μm |
| Repeatability | ±3.0 μm (3σ) |
| Working Area | 300 × 300 mm |
| Z Stroke | 50 mm |
| Rotation Axis | ±220° |
| Field of View | 9.6 × 7.2 mm |
| Generator | Digital phase control |
| Bond Force | 50–1,500 g |
Ultrasonic welding of solid pins, pin sockets, and eyelet pins onto DBC substrates and power semiconductor modules. A solder-free alternative for select bonding applications.
• Terminal welding of IGBT power modules
• Terminal welding of SiC power modules
