- Home
- Ultrasonic testing
Ultrasonic testing
Non-destructive ultrasonic testing for semiconductors and technical components
The ultrasound examination enables the non-destructive examination of components and material structures. High-frequency ultrasound allows the detection of internal structures, material boundaries, and defects that are not visible from the outside.
Our ultrasound testing systems are particularly suitable for testing Semiconductors, power electronics, electronic packages, ceramic substrates, and water-cooled components.
Depending on the test task, different test heads, frequencies, and scanning methods can be used. This allows internal defects to be located, analyzed, and represented in a visual way.
Typical applications
Semiconductors and IC Packages
Inspection of housings, bond and material layers for delaminations and defects
IGBT and SiC power modules
Inspection of seam connections, solder joints, and thermally stressed areas
DBC and ceramic substrates
Detection of detachments, voids, and structural irregularities
MLCC and electronic components
Investigation of internal structures and material connections
MEMS and sensors
Non-destructive analysis of sensitive multilayer structures
Flip-Chip Packages
Control of connections and interfaces within the package
Liquid-cooled Cold Plates
Examination of internal structures, gaps, and possible manufacturing defects
Relevant machines and technologies
