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Ultrasonic testing
Non-destructive ultrasonic testing for semiconductors and technical components
The ultrasound examination enables the non-destructive examination of components and material structures. High-frequency ultrasound allows the detection of internal structures, material boundaries, and defects that are not visible from the outside.
Our ultrasound testing systems are particularly suitable for testing Semiconductors, power electronics, electronic packages, ceramic substrates, and water-cooled components.
Depending on the test task, different test heads, frequencies, and scanning methods can be used. This allows internal defects to be located, analyzed, and represented in a visual way.
Typical applications
Semiconductors and IC Packages
Inspection of housings, bond and material layers for delaminations and defects
IGBT and SiC power modules
Inspection of seam connections, solder joints, and thermally stressed areas
DBC and ceramic substrates
Detection of detachments, voids, and structural irregularities
MLCC and electronic components
Investigation of internal structures and material connections
MEMS and sensors
Non-destructive analysis of sensitive multilayer structures
Flip-Chip Packages
Control of connections and interfaces within the package
Liquid-cooled Cold Plates
Examination of internal structures, gaps, and possible manufacturing defects
Other Applications
Please contact us to let us know your requirements.
How Ultrasonic Testing Works
In ultrasonic testing, high-frequency sound waves are transmitted into the test object. When the sound waves encounter material boundaries, voids, or other inhomogeneities, characteristic reflections are produced.
The transducer receives the ultrasonic signals and transmits them to the evaluation system. Various types of images can be generated from the measurement data, such as A-scan, B-scan, and C-scan.
This allows internal structures and defects to be examined non-destructively, without opening or damaging the component.
Typical Test Characteristics
Ultrasonic testing is particularly well-suited for the detection and analysis of:
- Delaminations
- Voids and Pores
- Cracks
- Delamination at Material Boundaries
- Bonding Errors
- internal material defects
- Welding defects
- Abnormalities at Joints
Depending on the material, component geometry, and testing task, appropriate frequencies and probes can be selected.
Application Range
IGBT and SiC Power Modules
IGBT and SiC Power Modules
Ultrasonic testing of power semiconductor modules to examine internal interfaces and detect possible delamination or voids.
- IGBT modules
- SiC Power Modules
- Power Modules
- DBC Substrates
Semiconductor Packages
Semiconductor Packages
Non-destructive testing of electronic packages and assemblies for internal defects and delamination.
- IC Packages
- Chip Packages
- Flip-Chip Packages
- MEMS
- ceramic substrates
Water-Cooled Cooling Plates
Water-Cooled Cooling Plates
Ultrasonic testing of liquid cold plates and water-cooled components to inspect welded joints and identify potential internal defects.
Other technical components
Other technical components
Depending on the material and geometry, the technology can also be used for other technical components and multilayer structures.
Testing Methods and Imaging
A-Scan
Plot of the received ultrasonic signals as a function of travel time. A-scan data allow for a detailed analysis of individual measurement points and material boundaries.
B-scan
Two-dimensional representation of a selected cross-sectional area. B-scan is suitable for analyzing the depth and extent of structures.
C-Scan
Two-dimensional visualization of a defined component plane. C-scan enables imaging analysis of larger test areas and is particularly well-suited for visualizing delaminations, voids, and other two-dimensional defects.
Probes for Various Applications
Depending on the application, probes are available, for example, in the following ranges:
- 15 MHz
- 25 MHz
- additional frequency ranges
available.
Selecting the appropriate probe is critical to the quality of the inspection. Depending on the material, component size, geometry, and desired resolution, different probes and frequencies can be used.
The focus, inspection area, and probe geometry can also be selected according to the specific inspection task.
Advantages of Ultrasonic Testing
- Non-Destructive Testing
- Analysis of Internal Structures
- Detection of Delaminations and Voids
- Imaging of Defects
- Inspection without disassembling the component
- Suitable for complex electronic components
- Various probes and frequencies can be used
- Suitable for research, development, and quality control
Custom Solutions for Power Semiconductors
Every semiconductor application places different demands on materials, component geometry, joining methods, and process parameters. Our ultrasonic systems can be designed and customized to suit the specific application.
We can assist you in selecting the appropriate technology, designing the process, and conducting feasibility studies and application tests.
Are you looking for the right ultrasonic solution for your semiconductor application?
Please contact us for a personalized consultation and feasibility study.
Relevant machines and technologies
