Semiconductors & Power Electronics

Ultrasonic technology enables precise and reproducible connections in the manufacturing of power semiconductors and electronic assemblies. Our systems support various applications such as Wire bonding, pin welding and terminal welding for modern power modules.

Through the controlled introduction of ultrasonic energy, electrical and mechanical connections can be produced with high process stability and repeatability. Depending on the component, material, and connection task, suitable ultrasonic frequencies, tools, and process parameters can be used.

Our solutions are particularly well-suited for IGBT modules, SiC power modules, power modules, DBC substrates, inverters, and on-board chargers as well as further applications in power electronics and automotive electronics.