- Products
- Semi-Automatic Scanning Acoustic Microscope (SAM)
Semi-Automatic Scanning Acoustic Microscope (SAM)
The semi-automatic ultrasonic scanning microscope extends the standard model with a bilateral automatic water immersion mechanism. It retains the flexibility of manual loading and unloading while reducing operational steps and reliance on operator expertise through automated immersion/emersion, automatic scanning, and automatic data processing. It is suitable for R&D validation and production sampling inspections with varying sample types, and represents a cost-effective automation upgrade over the standard offline system.
Application Range
Semiconductor packaging inspection for high-mix low-to-medium volume production, R&D process validation, and production quality sampling inspection
Product Advantages
- Bilateral automatic water immersion: carriers on both sides can immerse automatically, independently or coupled; prevents wet hands and improves operability
- Angled immersion design: the carrier enters the water tank at an angle, effectively removing air bubbles and preventing scan imaging interference
- Dual-head/dual-station design: two carriers are scanned simultaneously, significantly increasing inspection efficiency compared to a single station
- Quick-change carriers: supports rapid changeover of different workpieces, suitable for high-mix mixed inspection
- Optional C/T scans: front C-scan and rear T-scan can be configured for synchronous image output; dual-mode results in one scan
- Higher automation level than the standard offline system and lower initial investment than a fully automatic inline system; suitable for flexible production requirements
Technical Specifications
| Parameter | Specification |
| Overall Dimensions | 970 mm × 1,725 mm × 1,845 mm |
| Water Tank Dimensions | 650 mm × 1,500 mm × 150 mm (customizable) |
| Effective Scan Area | approx. 400 mm × 320 mm (total) |
| Maximum Scan Speed | 2,000 mm/s |
| X-Axis Acceleration | 2 g (manually or automatically adjustable) |
| Z-Axis Stroke | 0 ~ 100 mm |
| Probe Configuration | 1 or 2 C-scan probes, supports 5–500 MHz probes |
Delamination inspection of IGBT/SiC modules, delamination inspection of semiconductor chip packages, weld defect inspection of water-cooled heat sinks, diamond thickness measurement, and internal defect detection
