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An Overview of Our Ultrasound Products
Discover our industrial ultrasonic systems for precise welding, cutting, and testing. From ultrasonic cable welding machines and semiconductor welding systems to Scanning Acoustic Microscopes (SAM/SAT) and high-performance ultrasonic components, we offer reliable solutions for demanding industrial applications.
Cable-to-cable splicing, cable-to-terminal splicing, terminal-to-terminal splicing, and large-area splicing of copper and aluminum conductors. (Copper conductors: 95/120 mm²; aluminum conductors: up to 160 mm²)
Welding of copper and aluminum conductors to copper and aluminum terminals, braided conductors to copper terminals, and busbar tabs. (Copper conductors: 16–70 mm²)
Soldering small copper and aluminum conductors to various standard terminals up to 25 mm²
For small conductor cross-sections and compact cable connections in the electronics, automotive, and electrical engineering industries.
• Terminal welding of IGBT power modules
• Terminal welding of SiC power modules
Ultrasonic welding of solid pins, pin sockets, and eyelet pins onto DBC substrates and power semiconductor modules. A solder-free alternative for select bonding applications.
Ultrasonic wire bonding for IGBT and SiC power modules, as well as applications in automotive electronics, battery storage systems, onboard chargers, and laser systems.
Delamination inspection of IGBT/SiC modules, delamination inspection of semiconductor chip packages, weld defect inspection of water-cooled heat sinks, diamond thickness measurement, and internal defect detection
Semiconductor packaging inspection for high-mix low-to-medium volume production, R&D process validation, and production quality sampling inspection
Compatible with 20-kHz and 40-kHz ultrasonic cutting systems for cutting various tire rubber components
Increases or decreases the amplitude supplied by the converter to optimize ultrasonic energy output for different workpieces and processes.
Selection and design recommendations based on the customer’s workpiece material, geometry, and process requirements.
Precise cutting of textiles, films, rubber, composites, tire cord, and similar materials.
The probe is suitable for the non-destructive testing of semiconductor packages, power modules, water-cooled plates, composite materials, and other precision components.
