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An Overview of Our Ultrasound Products
Discover our industrial ultrasonic systems for precise welding, cutting, and testing. From ultrasonic cable welding machines and semiconductor welding systems to Scanning Acoustic Microscopes (SAM/SAT) and high-performance ultrasonic components, we offer reliable solutions for demanding industrial applications.
Cable-to-cable splicing, cable-to-terminal splicing, terminal-to-terminal splicing, and large-area splicing of copper and aluminum conductors. (Copper conductors: 95/120 mm²; aluminum conductors: up to 160 mm²)
Welding of copper and aluminum conductors to copper and aluminum terminals, braided conductors to copper terminals, and busbar tabs. (Copper conductors: 16–70 mm²)
Soldering small copper and aluminum conductors to various standard terminals up to 25 mm²
For small conductor cross-sections and compact cable connections in the electronics, automotive, and electrical engineering industries.
• Terminal welding of IGBT power modules
• Terminal welding of SiC power modules
Ultrasonic welding of solid pins, pin sockets, and eyelet pins onto DBC substrates and power semiconductor modules. A solder-free alternative for select bonding applications.
Ultrasonic wire bonding for IGBT and SiC power modules, as well as applications in automotive electronics, battery storage systems, onboard chargers, and laser systems.
The standard SAM is suitable for the nondestructive testing and detailed analysis of semiconductors, power electronics, and electronic packages. Typical applications include the delamination testing of IGBT and SiC modules, the examination of semiconductor packages, and the analysis of internal defects and connections.
The semi-automatic SAM is designed for the testing of a wide range of small and medium-sized series, as well as for use in production quality assurance. Automated testing processes enable the reproducible and efficient examination of defined component areas.
Compatible with 20-kHz and 40-kHz ultrasonic cutting systems for cutting various tire rubber components
Ultrasonic generators convert electrical energy into a high-frequency signal suitable for the specific process and form the basis for a stable ultrasonic process.
Available frequencies: 20 kHz, 30 kHz, 35 kHz, 40 kHz, and 60 kHz
The selection of the appropriate generator depends on the application, frequency, power, and the ultrasonic system used.
The transducer converts the electrical signal from the ultrasonic generator into mechanical ultrasonic vibrations. Selecting the right transducer is crucial for stable and efficient transmission of ultrasonic energy.
Available frequencies: 20 kHz, 30 kHz, 35 kHz, 40 kHz, 60 kHz
The booster transmits the ultrasonic vibration from the transducer to the sonotrode and can increase or decrease the amplitude to meet specific process requirements.
By selecting the appropriate booster, the ultrasonic amplitude can be adapted to the material, component geometry, and welding task.
The sonotrode transmits the ultrasonic vibration directly to the workpiece and is one of the most important tools for ensuring process quality.
The design of the sonotrode depends on: material, part geometry, welding surface, welding force, ultrasonic frequency, and the desired welded joint.
Magntek provides support in selecting and designing suitable sonotrodes for various ultrasonic welding applications.
The anvil serves as a counterpart to the sonotrode and holds the workpiece in place during ultrasonic welding.
Precise adaptation to the component geometry, welding area, and process requirements is crucial for stable workpiece positioning and reproducible weld quality.
Magntek offers custom-designed anvils for various welding applications.
Ultrasonic cutting blades enable precise and repeatable cutting of various materials. The ultrasonic vibration supports the cutting process and is adapted to the specific application.
Suitable for, among other things: textiles, films,
rubber, composite materials, tire cord, other elastic and technical materials,
The blade geometry, material, and surface coating can be selected according to the specific cutting application.
Probes are key components for non-destructive ultrasonic testing. They are used to detect and analyze ultrasonic signals in various components and materials.
Typical applications include: semiconductor packages, IGBT and SiC power modules, DBC substrates, water-cooled heat sinks, composite materials, and other precision components
Depending on the inspection task, the frequency, focus, and probe geometry can be adapted to the specific component and the desired resolution.
