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- IGBT/SiC Terminal Ultrasonic Welding System
IGBT/SiC Terminal Ultrasonic Welding System
The IGBT/SiC Terminal Ultrasonic Welding System was developed specifically for terminal bonding of power semiconductor modules and is suitable for highly reliable contacting of IGBT and SiC power modules.
The system combines a fully servo-driven motion system with optical positioning and process guidance technology, enabling highly precise automatic positioning and reproducible welding processes. Manual, semi-automatic, and fully automatic loading concepts are supported — from prototype manufacturing to series production.
The system processes terminal areas from 2 to 25 mm² with material thicknesses of 0.3 to 1.5 mm. All process data are traceable; MES system integration is possible as standard. An extraction and filter system for cleanroom applications is optionally available.
Application Range
•Terminal welding of IGBT power modules
•Terminal welding of SiC power modules
•Terminal welding of SiC power modules
Product Advantages
•Optical positioning combined with full servo drive for maximum positioning accuracy
•Flexible automation solutions for different production concepts
•Compatible with common IGBT and SiC terminal sizes
•Full process traceability in accordance with automotive standards
•Integrated process monitoring for closed-loop quality control
•Compatible with common IGBT and SiC terminal sizes
•Full process traceability in accordance with automotive standards
•Integrated process monitoring for closed-loop quality control
Technical Specifications
| Parameter | Specification |
| Operating Voltage | 380 V |
| Amplitude Control | 50–100 % |
| Weldable Terminal Area | 2–25 mm² |
| Material Thickness | 0.3–1.5 mm |
| Welding Modes | Time mode / Energy mode |
| Loading | Semi-automatic / Fully automatic |
| Positioning System | Optical positioning and process guidance |
| Drive System | Full servo system |
| Process Data | Fully traceable |
| MES Integration | Supported |
| Extraction System | Optional |
Ultrasonic wire bonding for IGBT and SiC power modules, as well as applications in automotive electronics, battery storage systems, onboard chargers, and laser systems.
Ultrasonic welding of solid pins, pin sockets, and eyelet pins onto DBC substrates and power semiconductor modules. A solder-free alternative for select bonding applications.
