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Semiconductors & Power Electronics
IGBT Modules · SiC Power Modules · DBC Substrates · Power Modules
Ultrasonic technology enables precise and reproducible connections in the manufacturing of power semiconductors and electronic assemblies. Our systems support various applications such as Wire bonding, pin welding and terminal welding for modern power modules.
Through the controlled introduction of ultrasonic energy, electrical and mechanical connections can be produced with high process stability and repeatability. Depending on the component, material, and connection task, suitable ultrasonic frequencies, tools, and process parameters can be used.
Our solutions are particularly well-suited for IGBT modules, SiC power modules, power modules, DBC substrates, inverters, and on-board chargers as well as further applications in power electronics and automotive electronics.
Application Range
20mil Copper Wire Bonding
Copper Ribbon Bonding
HPD-15mil AI Wire Bonding
IGBT
Pin Holder
Pin
Areas of Application
Ultrasonic Wire Bonding
Ultrasonic Wire Bonding
Ultrasonic wire bonding for the electrical interconnection of power semiconductors and electronic components.
Suitable for various bonding applications involving aluminum and copper wires as well as copper ribbons.
- IGBT modules
- SiC Power Modules
- Power Modules
- Automotive Electronics
- Battery and Energy Storage Systems
- On-Board Charger
- Laser Systems
Ultrasonic Spot Welding
Ultrasonic Spot Welding
Ultrasonic welding of pins and contact components for power semiconductor modules and DBC substrates.
This process is suitable for selected applications as an alternative to conventional brazing methods.
- Full pins
- Pin Socket
- Pin Connections on DBC Substrates
- Connectors in Power Modules
Ultrasonic Terminal Welding
Ultrasonic Terminal Welding
Ultrasonic welding of terminals and electrical contact components in IGBT and SiC power modules.
The process parameters can be adjusted according to the material, geometry, and component design.
- IGBT Terminals
- SiC Terminals
- Copper Terminals
- Aluminum Terminals
- electrical connections
Typical Applications in Power Electronics
IGBT modules
Ultrasonic wire bonding, pin welding, and terminal connections for IGBT power modules.
SiC Power Modules
Precise ultrasonic bonds for modern SiC power modules and applications with stringent requirements for electrical and thermal properties.
DBC Substrates
Ultrasonic pin and contact connections on DBC substrates for power electronics.
Power Electronics
Applications for inverters, power converters, charging electronics, and other power electronics.
Automotive Electronics
Ultrasonic joints for electric drive systems, on-board chargers, and other automotive electronics applications.
Custom Solutions for Power Semiconductors
Every semiconductor application places different demands on materials, component geometry, joining methods, and process parameters. Our ultrasonic systems can be designed and customized to suit the specific application.
We can assist you in selecting the appropriate technology, designing the process, and conducting feasibility studies and application tests.
Are you looking for the right ultrasonic solution for your semiconductor application?
Please contact us for a personalized consultation and feasibility study.
Relevant machines and technologies
